Nanostructured powder metal compact

ABSTRACT

A powder metal compact is disclosed. The powder metal compact comprises a cellular nanomatrix comprising a metallic nanomatrix material. The powder metal compact also comprises a plurality of dispersed particles comprising a metallic particle core material dispersed in the cellular nanomatrix, the particle core material comprising a nanostructured material.

BACKGROUND

Oil and natural gas wells often utilize wellbore components or toolsthat, due to their function, are only required to have limited servicelives that are considerably less than the service life of the well.After a component or tool service function is complete, it must beremoved or disposed of in order to recover the original size of thefluid pathway for use, including hydrocarbon production, CO₂sequestration, etc. Disposal of components or tools has conventionallybeen done by milling or drilling the component or tool out of thewellbore, which are generally time consuming and expensive operations.

In order to eliminate the need for milling or drilling operations, theremoval of components or tools from the wellbore by dissolution orcorrosion using various dissolvable or corrodible materials has beenproposed. While these materials are useful, it is also very desirablethat these materials be lightweight and have high strength, including astrength comparable to that of conventional engineering materials usedto form wellbore components or tools, such as various grades of steel.Thus, the further improvement of dissolvable or corrodible materials toincrease their strength, corrodibility and manufacturability is verydesirable.

SUMMARY

In an exemplary embodiment, a powder metal compact is disclosed. Thepowder metal compact comprises a cellular nanomatrix comprising ametallic nanomatrix material. The powder metal compact also comprises aplurality of dispersed particles comprising a metallic particle corematerial dispersed in the cellular nanomatrix, the particle corematerial comprising a nanostructured material.

BRIEF DESCRIPTION OF THE DRAWINGS

Referring now to the drawings wherein like elements are numbered alikein the several Figures:

FIG. 1 is a schematic illustration of an exemplary embodiment of apowder 10 and powder particles 12;

FIG. 2 is a schematic of illustration of an exemplary embodiment of thepowder compact have an equiaxed configuration of dispersed particles asdisclosed herein;

FIG. 3 is a schematic of illustration of an exemplary embodiment of thepowder compact have a substantially elongated configuration of dispersedparticles as disclosed herein;

FIG. 4 is a schematic of illustration of an exemplary embodiment of thepowder compact have a substantially elongated configuration of thecellular nanomatrix and dispersed particles, wherein the cellularnanomatrix and dispersed particles are substantially continuous; and

FIG. 5 is a schematic of illustration of an exemplary embodiment of thepowder compact have a substantially elongated configuration of thecellular nanomatrix and dispersed particles, wherein the cellularnanomatrix and dispersed particles are substantially discontinuous.

DETAILED DESCRIPTION

Lightweight, high-strength nanomatrix materials having dispersedparticles that include nanostructured particle core material aredisclosed. The nanostructured particle core material used to form thesenanomatrix materials are high-strength materials. Their strength mayalso be enhanced through the incorporation of nanostructuring into thenanomatrix materials. The strength of these alloys may also be improvedby the incorporation of various strengthening subparticles and secondparticles. The nanomatrix materials disclosed may also incorporatevarious microstructural features to control the alloy mechanicalproperties, such as the incorporation of a substantially elongatedparticle microstructure to enhance the alloy strength, or a multi-modalparticle size in the alloy microstructural to enhance the fracturetoughness, or a combination thereof to control both the strength,fracture toughness and other alloy properties.

The nanomatrix materials disclosed herein may be used in all manner ofapplications and application environments, including use in variouswellbore environments, to make various lightweight, high-strengtharticles, including downhole articles, particularly tools or otherdownhole components. In addition to their lightweight, high strengthcharacteristics, these nanomatrix materials may be described ascontrolled electrolytic materials, which may be selectably andcontrollably disposable, degradable, dissolvable, corrodible orotherwise removable from the wellbore. Many other applications for usein both durable and disposable or degradable articles are possible. Inone embodiment these lightweight, high-strength and selectably andcontrollably degradable materials include fully-dense, sintered powdercompacts formed from coated powder materials that include variouslightweight particle cores and core materials having various singlelayer and multilayer nanoscale coatings. In another embodiment, thesematerials include selectably and controllably degradable materials mayinclude powder compacts that are not fully-dense or not sintered, or acombination thereof, formed from these coated powder materials.

Nanomatrix materials and methods of making these materials are describedgenerally, for example, in U.S. patent application Ser. No. 12/633,682filed on Dec. 8, 2009 and U.S. patent application Ser. No. 13/194,361filed on Jul. 29, 2011, which are hereby incorporated herein byreference in their entirety. These lightweight, high-strength andselectably and controllably degradable materials may range fromfully-dense, sintered powder compacts to precursor or green state (lessthan fully dense) compacts that may be sintered or unsintered. They areformed from coated powder materials that include various lightweightparticle cores and core materials having various single layer andmultilayer nanoscale coatings. These powder compacts are made fromcoated metallic powders that include various electrochemically-active(e.g., having relatively higher standard oxidation potentials)lightweight, high-strength particle cores and core materials, such aselectrochemically active metals, that are dispersed within a cellularnanomatrix formed from the consolidation of the various nanoscalemetallic coating layers of metallic coating materials, and areparticularly useful in wellbore applications. The powder compacts may bemade by any suitable powder compaction method, including cold isostaticpressing (CIP), hot isostatic pressing (HIP), dynamic forging andextrusion, and combinations thereof. These powder compacts provide aunique and advantageous combination of mechanical strength properties,such as compression and shear strength, low density and selectable andcontrollable corrosion properties, particularly rapid and controlleddissolution in various wellbore fluids. The fluids may include anynumber of ionic fluids or highly polar fluids, such as those thatcontain various chlorides. Examples include fluids comprising potassiumchloride (KCl), hydrochloric acid (HCl), calcium chloride (CaCl₂),calcium bromide (CaBr₂) or zinc bromide (ZnBr₂). The disclosure of the'682 and '361 applications regarding the nature of the coated powdersand methods of making and compacting the coated powders are generallyapplicable to provide the lightweight, high-strength nanomatrixmaterials disclosed herein, and for brevity, are not repeated herein.

As illustrated in FIGS. 1 and 2, a powder 10 comprising powder particles12, including a particle core 14 and core material 18 and metalliccoating layer 16 and coating material 20, may be selected that isconfigured for compaction and sintering to provide a powder metalcompact 200 that is lightweight (i.e., having a relatively low density),high-strength and is selectably and controllably removable from awellbore in response to a change in a wellbore property, including beingselectably and controllably dissolvable in an appropriate wellborefluid, including various wellbore fluids as disclosed herein. The powdermetal compact 200 includes a cellular nanomatrix 216 comprising ananomatrix material 220 and a plurality of dispersed particles 214comprising a particle core material 218 dispersed in the cellularnanomatrix 216, wherein the particle core material 218 comprises ananostructured material.

Dispersed particles 214 may comprise any of the materials describedherein for particle cores 14, even though the chemical composition ofdispersed particles 214 may be different due to diffusion effects asdescribed herein. The dispersed particles 214 may be formed form anysuitable metallic particle core material 220 that includes nanostructureas described herein. In an exemplary embodiment, dispersed particles 214are formed from particle cores 14 comprising Al, Mg, Zn or Mn, or acombination thereof, as nanostructured particle core material 218. Moreparticularly, in an exemplary embodiment, dispersed particles 214 andparticle core material 218 may include various include various Al or Mgalloys as nanostructured particle core material 218, including variousprecipitation hardenable alloys Al or Mg alloys. Precipitationhardenable Al or Mg alloys are particularly useful because they affordthe opportunity to provide strengthening through both nanostructuringand precipitation hardening through the incorporation of subparticleprecipitates as described herein. Dispersed particles 214 and particlecore material 218 may also include a rare earth element, or acombination of rare earth elements. As used herein, rare earth elementsinclude Sc, Y, La, Ce, Pr, Nd or Er, or a combination of rare earthelements. Where present, a rare earth element or combination of rareearth elements may be present, by weight, in an amount of about 5percent or less.

Dispersed particle 214 and particle core material 218 also comprises ananostructured material 215. In an exemplary embodiment, ananostructured material 215 is a material having a grain size, or asubgrain or crystallite size, less than about 200 nm, and moreparticularly a grain size of about 10 nm to about 200 nm, and even moreparticularly an average grain size less than about 100 nm. Thenanostructure may include high angle boundaries 227, which are usuallyused to define the grain size, or low angle boundaries 229 that mayoccur as substructure within a particular grain, which are sometimesused to define a crystallite size, or a combination thereof. Thenanostructure may be formed in the particle core 14 used to formdispersed particle 214 by any suitable method, includingdeformation-induced nanostructure such as may be provided by ballmilling a powder to provide particle cores 14, and more particularly bycryomilling (e.g., ball milling in ball milling media at a cryogenictemperature or in a cryogenic fluid, such as liquid nitrogen) a powderto provide the particle cores 14 used to form dispersed particles 214.The particle cores 14 may be formed as a nanostructured material 215 byany suitable method, such as, for example, by milling or cryomilling ofprealloyed powder particles of the materials described herein. Theparticle cores 14 may also be formed by mechanical alloying of puremetal powders of the desired amounts of the various alloy constituents.Mechanical alloying involves ball milling, including cryomilling, ofthese powder constituents to mechanically enfold and intermix theconstituents and form particle cores 14. In addition to the creation ofnanostructure as described above, ball milling, including cryomilling,may contribute to solid solution strengthening of the particle core 14and core material 18, which in turn contribute to solid solutionstrengthening of dispersed particle 214 and particle core material 218.The solid solution strengthening may result from the ability tomechanically intermix a higher concentration of interstitial orsubstitutional solute atoms in the solid solution than is possible inaccordance with the particular alloy constituent phase equilibria,thereby providing an obstacle to, or serving to restrict, the movementof dislocations within the particle, which in turn provides astrengthening mechanism in particle core 14 and dispersed particle 214.Particle core 14 may also be formed as a nanostructured material 215 bymethods including inert gas condensation, chemical vapor condensation,pulse electron deposition, plasma synthesis, crystallization ofamorphous solids, electrodeposition and severe plastic deformation, forexample. The nanostructure also may include a high dislocation density,such as, for example, a dislocation density between about 10¹⁷ m⁻² and10¹⁸ m⁻², which may be two to three orders of magnitude higher thansimilar alloy materials deformed by traditional methods, such as coldrolling.

Dispersed particle 214 and particle core material 218 may also comprisea subparticle 222, and may preferably comprise a plurality ofsubparticles. Subparticle 222 provides a dispersion strengtheningmechanism within dispersed particle 214 and provides an obstacle to, orserves to restrict, the movement of dislocations within the particle.Subparticle 222 may have any suitable size, and in an exemplaryembodiment may have an average particle size of about 10 nm to about 1micron, and more particularly may have an average particle size of about50 nm to about 200 nm. Subparticle 222 may comprise any suitable form ofsubparticle, including an embedded subparticle 224, a precipitate 226 ora dispersoid 228. Embedded particle 224 may include any suitableembedded subparticle, including various hard subparticles. The embeddedsubparticle or plurality of embedded subparticles may include variousmetal, carbon, metal oxide, metal nitride, metal carbide, intermetalliccompound or cermet particles, or a combination thereof. In an exemplaryembodiment, hard particles may include Ni, Fe, Cu, Co, W, Al, Zn, Mn orSi, or an oxide, nitride, carbide, intermetallic compound or cermetcomprising at least one of the foregoing, or a combination thereof.Embedded subparticle 224 may be embedded by any suitable method,including, for example, by ball milling or cryomilling hard particlestogether with the particle core material 18. A precipitate subparticle226 may include any subparticle that may be precipitated within thedispersed particle 214, including precipitate subparticles 226consistent with the phase equilibria of constituents of the materials,particularly metal alloys, of interest and their relative amounts (e.g.,a precipitation hardenable alloy), and including those that may beprecipitated due to non-equilibrium conditions, such as may occur whenan alloy constituent that has been forced into a solid solution of thealloy in an amount above its phase equilibrium limit, as is known tooccur during mechanical alloying, is heated sufficiently to activatediffusion mechanisms that enable precipitation. Dispersoid subparticles228 may include nanoscale particles or clusters of elements resultingfrom the manufacture of the particle cores 14, such as those associatedwith ball milling, including constituents of the milling media (e.g.,balls) or the milling fluid (e.g., liquid nitrogen) or the surfaces ofthe particle cores 14 themselves (e.g., metallic oxides or nitrides).Dispersoid subparticles 228 may include, for example, Fe, Ni, Cr, Mn, N,O, C and H. The subparticles 222 may be located anywhere in conjunctionwith particle cores 14 and dispersed particles 214. In an exemplaryembodiment, subparticles 222 may be disposed within or on the surface ofdispersed particles 214, or a combination thereof, as illustrated inFIG. 1. In another exemplary embodiment, a plurality of subparticles 222are disposed on the surface of the particle core 14 and dispersedparticles 214 and may also comprise the nanomatrix material 216, asillustrated in FIG. 1.

Powder compact 200 includes a cellular nanomatrix 216 of a nanomatrixmaterial 220 having a plurality of dispersed particles 214 dispersedthroughout the cellular nanomatrix 216. The dispersed particles 214 maybe equiaxed in a substantially continuous cellular nanomatrix 216, ormay be substantially elongated as described herein and illustrated inFIG. 3. In the case where the dispersed particles 214 are substantiallyelongated, the dispersed particles 214 and the cellular nanomatrix 216may be continuous or discontinuous, as illustrated in FIGS. 4 and 5,respectively. The substantially-continuous cellular nanomatrix 216 andnanomatrix material 220 formed of sintered metallic coating layers 16 isformed by the compaction and sintering of the plurality of metalliccoating layers 16 of the plurality of powder particles 12, such as byCIP, HIP or dynamic forging. The chemical composition of nanomatrixmaterial 220 may be different than that of coating material 20 due todiffusion effects associated with the sintering. Powder metal compact200 also includes a plurality of dispersed particles 214 that compriseparticle core material 218. Dispersed particle cores 214 and corematerial 218 correspond to and are formed from the plurality of particlecores 14 and core material 18 of the plurality of powder particles 12 asthe metallic coating layers 16 are sintered together to form nanomatrix216. The chemical composition of core material 218 may also be differentthan that of core material 18 due to diffusion effects associated withsintering.

As used herein, the use of the term cellular nanomatrix 216 does notconnote the major constituent of the powder compact, but rather refersto the minority constituent or constituents, whether by weight or byvolume. This is distinguished from most matrix composite materials wherethe matrix comprises the majority constituent by weight or volume. Theuse of the term substantially-continuous, cellular nanomatrix isintended to describe the extensive, regular, continuous andinterconnected nature of the distribution of nanomatrix material 220within powder compact 200. As used herein, “substantially-continuous”describes the extension of the nanomatrix material throughout powdercompact 200 such that it extends between and envelopes substantially allof the dispersed particles 214. Substantially-continuous is used toindicate that complete continuity and regular order of the nanomatrixaround each dispersed particle 214 is not required. For example, defectsin the coating layer 16 over particle core 14 on some powder particles12 may cause bridging of the particle cores 14 during sintering of thepowder compact 200, thereby causing localized discontinuities to resultwithin the cellular nanomatrix 216, even though in the other portions ofthe powder compact the nanomatrix is substantially continuous andexhibits the structure described herein. In contrast, in the case ofsubstantially elongated dispersed particles 214, such as those formed byextrusion, “substantially discontinuous” is used to indicate thatincomplete continuity and disruption (e.g., cracking or separation) ofthe nanomatrix around each dispersed particle 214, such as may occur ina predetermined extrusion direction 622, or a direction transverse tothis direction. As used herein, “cellular” is used to indicate that thenanomatrix defines a network of generally repeating, interconnected,compartments or cells of nanomatrix material 220 that encompass and alsointerconnect the dispersed particles 214. As used herein, “nanomatrix”is used to describe the size or scale of the matrix, particularly thethickness of the matrix between adjacent dispersed particles 214. Themetallic coating layers that are sintered together to form thenanomatrix are themselves nanoscale thickness coating layers. Since thenanomatrix at most locations, other than the intersection of more thantwo dispersed particles 214, generally comprises the interdiffusion andbonding of two coating layers 16 from adjacent powder particles 12having nanoscale thicknesses, the matrix formed also has a nanoscalethickness (e.g., approximately two times the coating layer thickness asdescribed herein) and is thus described as a nanomatrix. Further, theuse of the term dispersed particles 214 does not connote the minorconstituent of powder compact 200, but rather refers to the majorityconstituent or constituents, whether by weight or by volume. The use ofthe term dispersed particle is intended to convey the discontinuous anddiscrete distribution of particle core material 218 within powdercompact 200.

Powder compact 200 may have any desired shape or size, including that ofa cylindrical billet, bar, sheet or other form that may be machined,formed or otherwise used to form useful articles of manufacture,including various wellbore tools and components. The pressing used toform precursor powder compact 100 and sintering and pressing processesused to form powder compact 200 and deform the powder particles 12,including particle cores 14 and coating layers 16, to provide the fulldensity and desired macroscopic shape and size of powder compact 200 aswell as its microstructure. The morphology (e.g. equiaxed orsubstantially elongated) of the dispersed particles 214 and cellularnetwork 216 of particle layers results from sintering and deformation ofthe powder particles 12 as they are compacted and interdiffuse anddeform to fill the interparticle spaces 15 (FIG. 1). The sinteringtemperatures and pressures may be selected to ensure that the density ofpowder compact 200 achieves substantially full theoretical density.

In an exemplary embodiment, dispersed particles 214 are formed fromparticle cores 14 dispersed in the cellular nanomatrix 216 of sinteredmetallic coating layers 16, and the nanomatrix 216 includes asolid-state metallurgical bond or bond layer, extending between thedispersed particles 214 throughout the cellular nanomatrix 216 that isformed at a sintering temperature (T_(S)), where T_(S) is less than themelting temperature of the coating (T_(C)) and the melting temperatureof the particle (T_(P)). As indicated, solid-state metallurgical bond isformed in the solid state by solid-state interdiffusion between thecoating layers 16 of adjacent powder particles 12 that are compressedinto touching contact during the compaction and sintering processes usedto form powder compact 200, as described herein. As such, sinteredcoating layers 16 of cellular nanomatrix 216 include a solid-state bondlayer that has a thickness defined by the extent of the interdiffusionof the coating materials 20 of the coating layers 16, which will in turnbe defined by the nature of the coating layers 16, including whetherthey are single or multilayer coating layers, whether they have beenselected to promote or limit such interdiffusion, and other factors, asdescribed herein, as well as the sintering and compaction conditions,including the sintering time, temperature and pressure used to formpowder compact 200.

As nanomatrix 216 is formed, including the metallurgical bond and bondlayer, the chemical composition or phase distribution, or both, ofmetallic coating layers 16 may change. Nanomatrix 216 also has a meltingtemperature (T_(M)). As used herein, T_(M) includes the lowesttemperature at which incipient melting or liquation or other forms ofpartial melting will occur within nanomatrix 216, regardless of whethernanomatrix material 220 comprises a pure metal, an alloy with multiplephases each having different melting temperatures or a composite,including a composite comprising a plurality of layers of variouscoating materials having different melting temperatures, or acombination thereof, or otherwise. As dispersed particles 214 andparticle core materials 218 are formed in conjunction with nanomatrix216, diffusion of constituents of metallic coating layers 16 into theparticle cores 14 is also possible, which may result in changes in thechemical composition or phase distribution, or both, of particle cores14. As a result, dispersed particles 214 and particle core materials 218may have a melting temperature (T_(DP)) that is different than T_(P). Asused herein, T_(DP) includes the lowest temperature at which incipientmelting or liquation or other forms of partial melting will occur withindispersed particles 214, regardless of whether particle core material218 comprise a pure metal, an alloy with multiple phases each havingdifferent melting temperatures or a composite, or otherwise. In oneembodiment, powder compact 200 is formed at a sintering temperature(T_(S)), where T_(S) is less than T_(C), T_(P), T_(M) and T_(DP), andthe sintering is performed entirely in the solid-state resulting in asolid-state bond layer. In another exemplary embodiment, powder compact200 is formed at a sintering temperature (T_(S)), where T_(S) is greaterthan or equal to one or more of T_(C), T_(P), T_(M) or T_(DP) and thesintering includes limited or partial melting within the powder compact200 as described herein, and further may include liquid-state orliquid-phase sintering resulting in a bond layer that is at leastpartially melted and resolidified. In this embodiment, the combinationof a predetermined T_(S) and a predetermined sintering time (t_(S)) willbe selected to preserve the desired microstructure that includes thecellular nanomatrix 216 and dispersed particles 214. For example,localized liquation or melting may be permitted to occur, for example,within all or a portion of nanomatrix 216 so long as the cellularnanomatrix 216/dispersed particle 214 morphology is preserved, such asby selecting particle cores 14, T_(S) and t_(S) that do not provide forcomplete melting of particle cores. Similarly, localized liquation maybe permitted to occur, for example, within all or a portion of dispersedparticles 214 so long as the cellular nanomatrix 216/dispersed particle214 morphology is preserved, such as by selecting metallic coatinglayers 16, T_(S) and t_(S) that do not provide for complete melting ofthe coating layer or layers 16. Melting of metallic coating layers 16may, for example, occur during sintering along the metallic layer16/particle core 14 interface, or along the interface between adjacentlayers of multi-layer coating layers 16. It will be appreciated thatcombinations of T_(S) and t_(S) that exceed the predetermined values mayresult in other microstructures, such as an equilibriummelt/resolidification microstructure if, for example, both thenanomatrix 216 (i.e., combination of metallic coating layers 16) anddispersed particles 214 (i.e., the particle cores 14) are melted,thereby allowing rapid interdiffusion of these materials.

Particle cores 14 and dispersed particles 214 of powder compact 200 mayhave any suitable particle size. In an exemplary embodiment, theparticle cores 14 may have a unimodal distribution and an averageparticle diameter or size of about 5 μm to about 300 μm, moreparticularly about 80 μm to about 120 μm, and even more particularlyabout 100 μm. In another exemplary embodiment, which may include amulti-modal distribution of particle sizes, the particle cores 14 mayhave average particle diameters or size of about 50 nm to about 500 μm,more particularly about 500 nm to about 300 μm, and even moreparticularly about 5 μm to about 300 μm. In an exemplary embodiment, theparticle cores 14 or the dispersed particles may have an averageparticle size of about 50 nm to about 500 μm.

Dispersed particles 214 may have any suitable shape depending on theshape selected for particle cores 14 and powder particles 12, as well asthe method used to sinter and compact powder 10. In an exemplaryembodiment, powder particles 12 may be spheroidal or substantiallyspheroidal and dispersed particles 214 may include an equiaxed particleconfiguration as described herein. In another exemplary embodiment,dispersed particles may have a non-spherical shape. In yet anotherembodiment, the dispersed particles may be substantially elongated in apredetermined extrusion direction 622, such as may occur when usingextrusion to form powder compact 200. As illustrated in FIG. 3-5, forexample, a substantially elongated cellular nanomatrix 616 comprising anetwork of interconnected elongated cells of nanomatrix material 620having a plurality of substantially elongated dispersed particle cores614 of core material 618 disposed within the cells. Depending on theamount of deformation imparted to form elongated particles, theelongated coating layers and the nanomatrix 616 may be substantiallycontinuous in the predetermined direction 622 as shown in FIG. 4, orsubstantially discontinuous as shown in FIG. 5.

The nature of the dispersion of dispersed particles 214 may be affectedby the selection of the powder 10 or powders 10 used to make particlecompact 200. In one exemplary embodiment, a powder 10 having a unimodaldistribution of powder particle 12 sizes may be selected to form powdercompact 200 and will produce a substantially homogeneous unimodaldispersion of particle sizes of dispersed particles 214 within cellularnanomatrix 216. In another exemplary embodiment, a plurality of powders10 having a plurality of powder particles with particle cores 14 thathave the same core materials 18 and different core sizes and the samecoating material 20 may be selected and uniformly mixed as describedherein to provide a powder 10 having a homogenous, multimodaldistribution of powder particle 12 sizes, and may be used to form powdercompact 200 having a homogeneous, multimodal dispersion of particlesizes of dispersed particles 214 within cellular nanomatrix 216.Similarly, in yet another exemplary embodiment, a plurality of powders10 having a plurality of particle cores 14 that may have the same corematerials 18 and different core sizes and the same coating material 20may be selected and distributed in a non-uniform manner to provide anon-homogenous, multimodal distribution of powder particle sizes, andmay be used to form powder compact 200 having a non-homogeneous,multimodal dispersion of particle sizes of dispersed particles 214within cellular nanomatrix 216. The selection of the distribution ofparticle core size may be used to determine, for example, the particlesize and interparticle spacing of the dispersed particles 214 within thecellular nanomatrix 216 of powder compacts 200 made from powder 10.

As illustrated generally in FIGS. 1 and 2, powder metal compact 200 mayalso be formed using coated metallic powder 10 and an additional orsecond powder 30, as described herein. The use of an additional powder30 provides a powder compact 200 that also includes a plurality ofdispersed second particles 234, as described herein, that are dispersedwithin the nanomatrix 216 and are also dispersed with respect to thedispersed particles 214. Dispersed second particles 234 may be formedfrom coated or uncoated second powder particles 32, as described herein.In an exemplary embodiment, coated second powder particles 32 may becoated with a coating layer 36 that is the same as coating layer 16 ofpowder particles 12, such that coating layers 36 also contribute to thenanomatrix 216. In another exemplary embodiment, the second powderparticles 232 may be uncoated such that dispersed second particles 234are embedded within nanomatrix 216. As disclosed herein, powder 10 andadditional powder 30 may be mixed to form a homogeneous dispersion ofdispersed particles 214 and dispersed second particles 234 or to form anon-homogeneous dispersion of these particles. The dispersed secondparticles 234 may be formed from any suitable additional powder 30 thatis different from powder 10, either due to a compositional difference inthe particle core 34, or coating layer 36, or both of them, and mayinclude any of the materials disclosed herein for use as second powder30 that are different from the powder 10 that is selected to form powdercompact 200. In an exemplary embodiment, dispersed second particles 234may include Ni, Fe, Cu, Co, W, Al, Zn, Mn or Si, or an oxide, nitride,carbide, intermetallic compound or cermet comprising at least one of theforegoing, or a combination thereof.

Nanomatrix 216 is a substantially-continuous, cellular network ofmetallic coating layers 16 that are sintered to one another. Thethickness of nanomatrix 216 will depend on the nature of the powder 10or powders 10 used to form powder compact 200, as well as theincorporation of any second powder 30, particularly the thicknesses ofthe coating layers associated with these particles. In an exemplaryembodiment, the thickness of nanomatrix 216 is substantially uniformthroughout the microstructure of powder compact 200 and comprises abouttwo times the thickness of the coating layers 16 of powder particles 12.In another exemplary embodiment, the cellular network 216 has asubstantially uniform average thickness between dispersed particles 214of about 50 nm to about 5000 nm. Powder compacts 200 formed by extrusionmay have much smaller thicknesses, and may become non-uniform andsubstantially discontinuous, as described herein.

Nanomatrix 216 is formed by sintering metallic coating layers 16 ofadjacent particles to one another by interdiffusion and creation of bondlayer as described herein. Metallic coating layers 16 may be singlelayer or multilayer structures, and they may be selected to promote orinhibit diffusion, or both, within the layer or between the layers ofmetallic coating layer 16, or between the metallic coating layer 16 andparticle core 14, or between the metallic coating layer 16 and themetallic coating layer 16 of an adjacent powder particle, the extent ofinterdiffusion of metallic coating layers 16 during sintering may belimited or extensive depending on the coating thicknesses, coatingmaterial or materials selected, the sintering conditions and otherfactors. Given the potential complexity of the interdiffusion andinteraction of the constituents, description of the resulting chemicalcomposition of nanomatrix 216 and nanomatrix material 220 may be simplyunderstood to be a combination of the constituents of coating layers 16that may also include one or more constituents of dispersed particles214, depending on the extent of interdiffusion, if any, that occursbetween the dispersed particles 214 and the nanomatrix 216. Similarly,the chemical composition of dispersed particles 214 and particle corematerial 218 may be simply understood to be a combination of theconstituents of particle core 14 that may also include one or moreconstituents of nanomatrix 216 and nanomatrix material 220, depending onthe extent of interdiffusion, if any, that occurs between the dispersedparticles 214 and the nanomatrix 216.

In an exemplary embodiment, the nanomatrix material 220 has a chemicalcomposition and the particle core material 218 has a chemicalcomposition that is different from that of nanomatrix material 220, andthe differences in the chemical compositions may be configured toprovide a selectable and controllable dissolution rate, including aselectable transition from a very low dissolution rate to a very rapiddissolution rate, in response to a controlled change in a property orcondition of the wellbore proximate the compact 200, including aproperty change in a wellbore fluid that is in contact with the powdercompact 200, as described herein. Nanomatrix 216 may be formed frompowder particles 12 having single layer and multilayer coating layers16. This design flexibility provides a large number of materialcombinations, particularly in the case of multilayer coating layers 16,that can be utilized to tailor the cellular nanomatrix 216 andcomposition of nanomatrix material 220 by controlling the interaction ofthe coating layer constituents, both within a given layer, as well asbetween a coating layer 16 and the particle core 14 with which it isassociated or a coating layer 16 of an adjacent powder particle 12.

In an exemplary embodiment, nanomatrix 216 may comprise a nanomatrixmaterial 220 comprising Ni, Fe, Cu, Co, W, Al, Zn, Mn, Mg or Si, or analloy thereof, or an oxide, nitride, carbide, intermetallic compound orcermet comprising at least one of the foregoing, or a combinationthereof.

The powder metal compacts 200 disclosed herein may be configured toprovide selectively and controllably disposable, degradable,dissolvable, corrodible or otherwise removable from a wellbore using apredetermined wellbore fluid, including those described herein. Thesematerials may be configured to provide Al alloys with a rate ofcorrosion up to about 400 mg/cm²/hr, and more particularly a rate ofcorrosion of about 0.5 to about 100 mg/cm²/hr. The Al alloy powdercompacts 200 may also be configured to provide high strength, includingan ultimate compressive strength up to about 150 ksi, and moreparticularly from about 60 ksi to about 150 ksi, and even moreparticularly about 60 ksi to about 120 ksi. These materials may also beconfigured to provide Mg alloys with a rate of corrosion up to about 500mg/cm²/hr, and more particularly a rate of corrosion of about 0.5 toabout 50 mg/cm²/hr. The Mg alloy powder compacts 200 may also beconfigured to provide high strength, including an ultimate compressivestrength up to about 85 ksi, and more particularly from about 40 ksi toabout 70 ksi.

The terms “a” and “an” herein do not denote a limitation of quantity,but rather denote the presence of at least one of the referenced items.The modifier “about” used in connection with a quantity is inclusive ofthe stated value and has the meaning dictated by the context (e.g.,includes the degree of error associated with measurement of theparticular quantity). Furthermore, unless otherwise limited all rangesdisclosed herein are inclusive and combinable (e.g., ranges of “up toabout 25 weight percent (wt. %), more particularly about 5 wt. % toabout 20 wt. % and even more particularly about 10 wt. % to about 15 wt.%” are inclusive of the endpoints and all intermediate values of theranges, e.g., “about 5 wt. % to about 25 wt. %, about 5 wt. % to about15 wt. %”, etc.). The use of “about” in conjunction with a listing ofconstituents of an alloy composition is applied to all of the listedconstituents, and in conjunction with a range to both endpoints of therange. Finally, unless defined otherwise, technical and scientific termsused herein have the same meaning as is commonly understood by one ofskill in the art to which this invention belongs. The suffix “(s)” asused herein is intended to include both the singular and the plural ofthe term that it modifies, thereby including one or more of that term(e.g., the metal(s) includes one or more metals). Reference throughoutthe specification to “one embodiment”, “another embodiment”, “anembodiment”, and so forth, means that a particular element (e.g.,feature, structure, and/or characteristic) described in connection withthe embodiment is included in at least one embodiment described herein,and may or may not be present in other embodiments.

It is to be understood that the use of “comprising” in conjunction withthe alloy compositions described herein specifically discloses andincludes the embodiments wherein the alloy compositions “consistessentially of” the named components (i.e., contain the named componentsand no other components that significantly adversely affect the basicand novel features disclosed), and embodiments wherein the alloycompositions “consist of” the named components (i.e., contain only thenamed components except for contaminants which are naturally andinevitably present in each of the named components).

While one or more embodiments have been shown and described,modifications and substitutions may be made thereto without departingfrom the spirit and scope of the invention. Accordingly, it is to beunderstood that the present invention has been described by way ofillustrations and not limitation.

The invention claimed is:
 1. A powder metal compact, comprising: asubstantially-continuous, cellular nanomatrix comprising a metallicnanomatrix material; a plurality of dispersed particles comprising ametallic particle core material dispersed in the cellular nanomatrix,the metallic particle core material comprising a nanostructured materialdefined by a grain size or subgrain size less than 200 nm that isdefined by grain boundaries, within the metallic particle core material;and a solid-state bond layer extending throughout the cellularnanomatrix between the dispersed particles, the solid-state bond layerformed by solid-state bonding.
 2. The powder metal compact of claim 1,wherein the particle core material comprises Al, Mg, Zn or Mn, or acombination thereof.
 3. The powder metal compact of claim 2, wherein thenanomatrix material comprises an Al alloy or an Mg alloy.
 4. The powdermetal compact of claim 1, wherein the nanomatrix material furthercomprises a second nanostructured material.
 5. The powder metal compactof claim 4, wherein the second nanostructured material has a grain sizeof about 10 nm to about 200 nm.
 6. The powder metal compact of claim 1,wherein the nanostructured material has an average grain size less thanabout 100 nm.
 7. The powder metal compact of claim 1, wherein thedispersed particle further comprises a subparticle.
 8. The powder metalcompact of claim 7, wherein the subparticle has an average particle sizeof about 10 nm to about 1 micron.
 9. The powder metal compact of claim7, wherein the subparticle comprises a preformed subparticle, aprecipitate or a dispersoid.
 10. The powder metal compact of claim 7,wherein the subparticle is disposed within or on the surface of thedispersed particle, or a combination thereof.
 11. The powder metalcompact of claim 10, wherein the subparticle is disposed on the surfaceof the dispersed particle and also comprises the nanomatrix material.12. The powder metal compact of claim 1, wherein the dispersed particleshave an average particle size of about 50 nm to about 500 μm.
 13. Thepowder metal compact of claim 1, wherein the dispersed particlescomprise a multi-modal distribution of particle sizes within thecellular nanomatrix.
 14. The powder metal compact of claim 1, whereinthe particle core material further comprises a rare earth element. 15.The powder metal compact of claim 1, wherein the dispersed particleshave an equiaxed particle shape.
 16. The powder metal compact of claim1, wherein the nanomatrix and the dispersed particles are substantiallyelongated in a predetermined direction.
 17. The powder metal compact ofclaim 1, wherein the dispersed particles are substantiallydiscontinuous.
 18. The powder metal compact of claim 1, furthercomprising a plurality of dispersed second particles, wherein thedispersed second particles are also dispersed within the cellularnanomatrix and with respect to the dispersed particles.
 19. The powdermetal compact of claim 18, wherein the dispersed second particlescomprise a metal, carbon, metal oxide, metal nitride, metal carbide,intermetallic compound or cermet, or a combination thereof.
 20. Thepowder metal compact of claim 19, wherein the dispersed second particlescomprise Ni, Fe, Cu, Co, W, Al, Mg, Zn, Mn or Si, or an oxide, nitride,carbide, intermetallic compound or cermet comprising at least one of theforegoing, or a combination thereof.
 21. The powder metal compact ofclaim 1, wherein the nanomatrix material comprises a metal, carbon,metal oxide, metal nitride, metal carbide, intermetallic compound orcermet, or a combination thereof.
 22. The powder metal compact of claim1, wherein the nanomatrix material comprises a constituent of a millingmedium or a milling fluid.
 23. The powder metal compact of claim 21,wherein the nanomatrix material comprises Ni, Fe, Cu, Co, W, Al, Zn, Mn,Mg or Si, or an oxide, nitride, carbide, intermetallic compound orcermet comprising at least one of the foregoing, or a combinationthereof.
 24. The powder metal compact of claim 1, wherein the nanomatrixmaterial comprises a multilayer material.
 25. The powder metal compactof claim 1, wherein the nanomatrix material has a chemical compositionand the particle core material has a chemical composition that isdifferent than the chemical composition of the nanomatrix material. 26.The powder metal compact of claim 1, wherein the cellular nanomatrix hasan average thickness of about 50 nm to about 5000 nm.
 27. A powder metalcompact, comprising: a substantially-continuous, cellular nanomatrixcomprising a metallic nanomatrix material; a plurality of dispersedparticles that are substantially elongated in a predetermined directioncomprising a metallic particle core material dispersed in the cellularnanomatrix, the metallic particle core material comprising ananostructured material defined by a grain size or subgrain size lessthan 200 nm that is defined by grain boundaries, within the metallicparticle core material; and a solid-state bond layer extendingthroughout the cellular nanomatrix between the dispersed particles, thesolid-state bond layer formed by solid-state bonding.